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US 2008/0165497 A1Published application
Quasi-radial heatsink with rectangular form factor and uniform fin length
AssigneeIntel Corporation
InventorsMark J. Gallina, Kevin Ceurter
Life of this patent
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Abstract
In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed.
Claims42
An apparatus, comprising:
- a thermally conductive core;
- and
- at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,
- and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.
1 more element
A method, comprising:
- forming a thermally conductive core;
- and
- forming at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,
- and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.
1 more element
A system, comprising:
- a system board;
- an electronic component on the system board;
- and
- a heatsink thermally coupled to the electronic component, the heatsink comprising:
- a thermally conductive core;
- and
- at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,
- and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.
5 more elements
Dependencies are inferred from the claim text.