Electric power semiconductor device

An electric power semiconductor device comprising:

• first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively;
• first and second semiconductor chips mounted on the first and second circuit patterns, respectively;
• an electrode terminal disposed between the first and second insulating substrates;
• a connecting conductor for connecting between the electrode terminal and the first circuit pattern;
• and
• a bonding wire for connecting between the electrode terminal and the second semiconductor chip,
• wherein the connecting conductor is formed of an extending portion extended from a part of the electrode terminal, and one end portion of the extending portion is connected to the first circuit pattern by a solder.

An electric power semiconductor device comprising:

• first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively;
• first and second semiconductor chips mounted on the first and second circuit patterns, respectively;
• first, second and third electrode terminals which are laminated from an upper position to a lower position in this order, and disposed between the first and second insulating substrates;
• a first bonding wire for connecting between the first semiconductor chip and the first electrode terminal;
• a second bonding wire for connecting between the second semiconductor chip and the second electrode terminal;
• a first connecting conductor for connecting between the second electrode terminal and the first circuit pattern;
• and
• a second connecting conductor for connecting between the third electrode terminal and the second circuit pattern,
• wherein the first connecting conductor is formed of a first extending portion extended from a part of the second electrode terminal, and the second connecting conductor is formed of a second extending portion extended from a part of the third electrode terminal, and
• wherein one end portion of the first extending portion is connected to the first circuit pattern by a solder, and one end portion of the second extending portion is connected to the second circuit pattern by a solder.