US 2008/0164616 A1 · Strip Conductor Structure for Minimizing Thermomechanical Loads

Abstract

A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

Claims23

Dependent claims

A semiconductor chip device, comprising:

a surface on which at least one electrical contact surface is provided;
a foil, made from electrically insulating material, is provided on the surface, the foil including a window at the contact surface in which the contact surface is free of the foil and planar contact is established with at least, one layer made from electrically conducting material, whereby the layer, made from electrically conducting material, is part of a facility, which is mechanically flexible because of its geometry, for establishing the electrical connection between the contact surface and at least one outer connecting conductor, and whereby, originating from the layer made from electrically conducting material, at least one strip conductor running radially toward the outside extends by way of an outer strip conductor pinto the outer connecting conductor, the outer strip conductor framing the window and the outer connecting conductor being provided on the foil.

A device made from a substrate with including a surface on which at least one electrical contact surface provided, whereby a foil made from electrically insulating material is provided on the surface, whereby the foil has a window at the contact surface in which the contact surface is free of the foil and planar contact is established with at least one layer made from electrically conducting material, whereby the layer, made from electrically conducting material, is part of a facility, which is mechanically flexible because of its geometry, for establishing the electrical connection between the contact surface and at least one outer connecting conductor, and whereby originating from the layer made from electrically conducting material, at least one strip conductor running radially toward the outside extends by way of an outer strip conductor into the outer connecting conductor, the outer strip conductor framing the window and the outer connecting conductor being provided on the foil.

Dependencies are inferred from the claim text.

Strip Conductor Structure for Minimizing Thermomechanical Loads

Life of this patent

Strip Conductor Structure for Minimizing Thermomechanical Loads

Life of this patent

Abstract

Claims23