Back to results
US 2008/0164606 A1Published application
Spacers for wafer bonding
OwnerChristoffer Graae Greisen, Lior Shiv +1inventors
InventorsChristoffer Graae Greisen, Lior Shiv, Paul N. Egginton
Life of this patent
Estimating the term…
Abstract
A deformable spacer for wafer bonding applications is disclosed. The spacer may be used to keep wafers separated until desired conditions are achieved.
Claims37
A wafer bonding process comprising:
- placing a spacer between a first and second wafer to separate a first bonding surface of the first wafer from a second bonding surface of the second wafer;
- aligning the first wafer above the second wafer;
- transporting the wafer stack to a bonding chamber;
- applying a physical stimulus to cause the spacer to change its state, thereby allowing the first bonding surface to contact the second bonding surface;
- and
- causing the first bonding surface to bond with the second bonding surface.
3 more elements
A wafer stack comprising:
- a first wafer;
- a second wafer;
- and
- a spacer adapted to separate a first bonding surface of the first wafer and a second bonding surface of a second wafer,
- wherein the spacer is further adapted to change its state in response to a physical stimulus such that the first bonding surface contacts the second bonding surface.
2 more elements
A method of bonding wafers comprising:
- placing a spacer between a first wafer and a second wafer, wherein the spacer separates a first bonding surface of the first wafer from a second bonding surface of the second wafer;
- applying a first physical stimulus to cause the spacer to change its state, allowing the first bonding surface to contact the second bonding surface;
- and
- bonding the first bonding surface to the second bonding surface.
1 more element
A method of bonding wafers comprising:
- placing a plurality of wafers in a stack;
- placing spacers between each pair of wafers in the stack, wherein each spacer separates a first bonding surface of a first wafer in each pair of wafers from a second bonding surface of an adjacent wafer in the pair;
- placing the wafer stack in a bonding chamber;
- applying a physical stimulus to cause the spacers to change their state, allowing the first bonding surface of the first wafer in each pair to contact the second bonding surface of the adjacent wafer in each pair;
- and
- bonding the first bonding surface of the first wafer in each pair to the second bonding surface of the adjacent wafer in each pair.
3 more elements
Dependencies are inferred from the claim text.