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US 2008/0164602 A1Published application
Cap package for micro electro-mechanical system capable of minimizing electro-magnetic interference
AssigneeLingsen Precision Industries, Ltd.
InventorsJiung-Yue TIEN, Ming-Te Tu, Chin-Ching Huang
Life of this patent
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Abstract
A cap package for MEMS includes a substrate, a cap made of a carbon added plastic material and capped on the substrate to define with the substrate an accommodation chamber, and a chip mounted on the substrate and located inside the accommodation chamber. The substrate has a conducting portion electrically connected with the cap and grounded.
Claims7
A cap package for micro electro-mechanical system, comprising:
- a substrate;
- a cap made of a carbon added plastic material and capped on the substrate to define with the substrate an accommodation chamber;
- and
- a chip mounted on the substrate and located inside the accommodation chamber.
1 more element
Dependencies are inferred from the claim text.