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US 2008/0164598 A1Published application
Semiconductor module
OwnerHorst Theussinventor
Life of this patent
Estimating the term…
Abstract
A module includes a semiconductor chip, which has at least one movable element, a first substrate of a glass material or semiconductor material, which covers a first main surface of the semiconductor chip, and a second substrate of a glass material or semiconductor material, which covers a second main surface of the semiconductor chip. Part at least of the semiconductor chip or of the first substrate or of the second substrate lies open.
Claims32
A module comprising:
- a semiconductor chip, which has at least one movable element;
- a first substrate of a glass material or semiconductor material, which covers a first main surface of the semiconductor chip;
- and
- a second substrate of a glass material or semiconductor material, which covers a second main surface of the semiconductor chip,
- wherein at least part of the semiconductor chip or of the first substrate or of the second substrate lying open.
2 more elements
A method, comprising:
- providing a semiconductor substrate, the semiconductor substrate having at least two movable elements;
- applying a first substrate of a glass material or semiconductor material to a first main surface of the semiconductor substrate;
- and
- separating after the application of the first substrate to the first main surface of the semiconductor substrate, the semiconductor substrate into at least two semiconductor modules, each of the at least two semiconductor modules having at least one movable element.
1 more element
A module comprising:
- a semiconductor chip, which has at least one movable element;
- a first substrate, which covers a first main surface of the semiconductor chip and has a coefficient of thermal expansion in the range from 0.3·10−6/K to 8.2·10−6/K;
- and
- a second substrate, which covers a second main surface of the semiconductor chip and has a coefficient of thermal expansion in the range from 0.3·10−6/K to 8.2·10−6/K,
- at least part of the semiconductor chip or of the first substrate or of the second substrate lying open.
2 more elements
A method, comprising:
- providing a semiconductor substrate, the semiconductor substrate having at least two movable elements;
- applying a first substrate, which has a coefficient of thermal expansion in the range from 0.3·10−6/K to 8.2·10−6/K, to a first main surface of the semiconductor substrate;
- and
- separating after the application of the first substrate to the first main surface of the semiconductor substrate, the semiconductor substrate into at least two semiconductor modules, each of the at least two semiconductor modules having at least one movable element.
1 more element
A module comprising:
- a semiconductor chip, which has at least one movable element;
- a first substrate, which covers a first main surface of the semiconductor chip;
- and
- a second substrate, which covers a second main surface of the semiconductor chip and has at least one recess facing the at least one movable element,
- at least part of the semiconductor chip or of the first substrate or of the second substrate lying open.
2 more elements
A method, comprising:
- providing a semiconductor substrate having at least two movable elements;
- applying a first substrate to a first main surface of the semiconductor substrate;
- applying a second substrate with a side which has at least one recess to a second main surface of the semiconductor substrate;
- and
- separating after the application of the first substrate and of the second substrate to the main surfaces of the semiconductor substrate, the semiconductor substrate into at least two semiconductor modules, each of the at least two semiconductor modules having at least one movable element.
2 more elements
Dependencies are inferred from the claim text.