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US 2008/0164585 A1Published application
Semiconductor device
AssigneesElpida Memory, Inc., Hitachi Research Laboratory, Hitachi, Ltd.
InventorsKazutaka Koshiishi, Mitsuaki Katagiri, Satoshi Isa, Haruo Akahoshi
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Abstract
A semiconductor device is mounted on a package substrate which has a power supply line and a signal line formed of a normal or predetermined resistance material layer on a dielectric layer. A resistance material layer has a high resistance as compared with the normal resistance material layer and is additionally provided on the surface of the normal resistance material layer of the peripheral face of the signal line closest to the power supply line.
Claims13
A semiconductor device mounted on a package substrate, wherein:
- the package substrate comprises:
- a dielectric layer;
- a power supply line and a signal line both of which are formed on the dielectric layer by a predetermined resistance material layer;
- and
- a high resistance material layer which is provided on the surface of the predetermined resistance material layer of the peripheral face of the signal line closest to the power supply line and which has a high resistance as compared with the predetermined resistance material layer.
2 more elements
Dependencies are inferred from the claim text.