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US 2008/0164564 A1Published application
Micromechanical component having integrated passive electronic components and method for its production
OwnerHeiko Stahl, Christian Ohl +1inventors
InventorsHeiko Stahl, Christian Ohl, Frank Fischer
Life of this patent
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Abstract
A micromechanical component includes a substrate, on which at least one layer sequence is situated, which includes at least one micromechanical functional element, and on which at least one layer sequence is situated that is able to act as at least one macroelectronic, passive component.
Claims10
A micromechanical component comprising:
- a substrate;
- at least one first layer sequence situated on the substrate, the at least one first layer sequence including at least one micromechanical functional element;
- and
- at least one second layer sequence situated on the substrate, the at least one second layer sequence being able to act as at least one macroelectronic, passive component.
1 more element
A system comprising:
- at least one micromechanical component;
- and
- at least one microelectronic component,
- wherein the at least one micromechanical component is combined with the at least one microelectronic component, to form a functional unit, there being an interconnection inside the functional unit which incorporates capacitors, integrated into the micromechanical component, as buffer capacitors for the microelectronic component.
1 more element
A method for producing a micromechanical component comprising:
- producing at least one micromechanical functional layer on a substrate by successive depositing steps and patterning steps,
- wherein at least one of (a) the depositing steps and (b) the patterning steps are undertaken which produce at least one layer sequence on the same substrate, which is able to act as at least one macroelectronic, passive component.
Dependencies are inferred from the claim text.