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US 2008/0164546 A1Published application
Design of MEMS Packaging
AssigneeInfineon Technologies Sensonor AS
InventorsTerje Kvisteroy, Eskild Westby
Life of this patent
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Abstract
A micro-electromechanical device comprises a micro-electromechanical die, a package, and three pillars attaching the micro-electromechanical die to the package, at least one of the shape, position and orientation of the pillars is configured such that any strain transferred from the package to the die by deformation of the package is minimized.
Claims7
A micro-electromechanical device comprising:
- a micro-electromechanical die;
- a package;
- and
- three pillars attaching the micro-electromechanical die to the package;
- wherein at least one of the shape, position and orientation of the pillars is configured such that any strain transferred from the package to the die by deformation of the package is minimized.
2 more elements
Dependencies are inferred from the claim text.