Methods and systems for wafer level packaging of mems structures
AssigneeMiradia Inc.
InventorsXiao Yang, Justin Payne, Yuxiang Wang, Wook Ji, Ye Wang
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Abstract
A method of forming a package for a MEMS structure coupled to a substrate includes depositing an encapsulant material on the substrate and patterning the encapsulant material to form a plurality of encapsulated structures. The method also includes depositing a first capping layer on the substrate and forming one or more release hole patterns in the first capping layer. The method further includes removing the encapsulant material and depositing a second capping layer.
Claims20
A method of forming a package for a MEMS structure coupled to a substrate, the method comprising:
- depositing an encapsulant material on the substrate;
- patterning the encapsulant material to form a plurality of encapsulated structures;
- depositing a first capping layer on the substrate;
- forming one or more release hole patterns in the first capping layer;
- removing the encapsulant material;
- and
- depositing a second capping layer.
A package for a MEMS structure, the package comprising:
- a MEMS structure coupled to a substrate;
- a cavity region adjacent the MEMS structure and extending to a predetermined distance from the substrate;
- a first sealant layer having a first portion joined to the substrate and a second portion disposed over the cavity region;
- and
- a second sealant layer having a first portion joined to the first portion of the first sealant layer and a second portion joined to the second portion of the first sealant layer.
Dependencies are inferred from the claim text.