A method for manufacturing a metal-oxide-semiconductor field-effect transistor, comprising the steps of:
- forming a P-type substrate;
- forming a N-type well in the P-type substrate;
- forming a gate oxide layer on the N-type well;
- forming a conductor layer on the gate oxide layer, the conductor layer being coupled to the ground;
- and
- forming a first N-type doping region and a second N-type doping region, the N-type well covering one boundary of the first and the second N-type doping regions, respectively, the first N-type doping region being coupled to the power supply, and the second N-type doping region being coupled to a power-supply pad;
- wherein a PN junction formed by the second N-type doping region and the P-type substrate leads electrostatic-discharge current to the ground when the metal-oxide-semiconductor field-effect transistor is not operating and the first and the second N-type doping regions forms a voltage-stabilizing capacitor between the power supply and the ground when the metal-oxide-semiconductor field-effect transistor is operating.