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US 2008/0157433 A1Published application
Method of Manufacture of Encapsulated Package
AssigneeInfineon Technologies AG
InventorsChai Wei Heng, Yang Hong Heng, Yong Chern Poh
Life of this patent
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Abstract
There is provided a method of making an encapsulated component package, including providing a support for supporting the components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package, rupturing the support legs, and covering the exposed ends of the legs with an insulating material. There is also provided a package formed in accordance with the method.
Claims15
A method of making an encapsulated component package, the method comprising:
- providing a support for supporting components of the package during encapsulation, the support including legs extending beyond the perimeter of the final package;
- rupturing the support legs;
- and
- covering exposed ends of the legs with an insulating material.
1 more element
Dependencies are inferred from the claim text.