Semocondutor device having multiple-layer hard mask with opposite stresses and method for fabricating the same
AssigneeHynix Semiconductor Inc.
InventorsJung-Seock Lee, Ki-Won Nam
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Abstract
A semiconductor device includes a hard mask including a first layer and a second layer in contact with each other and having opposite stress types, wherein a difference between initial stresses of the first layer and the second layer is increased so that after a thermal process, the difference between the final stresses of the first and second layer becomes smaller, to reduce the likelihood of peeling of the first or second layer. The initial stress of the first layer includes a compressive stress and the initial stress of the second layer includes a tensile stress.
Claims19
A semiconductor device, comprising a hard mask including a first layer and a second layer in contact with each other and having opposite stress types, wherein a large difference exists between initial stresses of the first layer and the second layer, and a small difference exists between final stresses of the first and second layers.
A method for fabricating a semiconductor device, comprising forming a hard mask including a first layer and a second layer in contact with each other and having opposite types of stress, wherein prior to a thermal process, a large difference exists between initial stresses of the first layer and the second layer, and after the thermal process a small difference exists between the stresses of the first and second layer.
Dependencies are inferred from the claim text.