Wafer level package with die receiving through-hole and method of the same
AssigneeAdvanced Chip Engineering Technology Inc.
InventorWen-Kun Yang
Life of this patent
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Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.
Claims20
A structure of semiconductor device package comprising:
- a substrate with a die receiving through hole and contact metal pads;
- a base attached on a lower surface of said substrate;
- a die disposed within said die receiving through hole and attached on said base;
- a dielectric layer formed on said die and said substrate;
- a redistribution layer (RDL) formed on said dielectric layer and coupled to said die;
- a protection layer formed over said RDL;
- and
- pluralities of terminal pads Conned on said protection layer and coupled to said RDL.
A method for forming semiconductor device package comprising:
- providing a substrate with die receiving through holes and contact metal pads;
- printing patterned glues on a die redistribution tool;
- redistributing desired dice on said die redistribution tool with desired pitch by a pick and place fine alignment system;
- bonding said substrate to said die redistribution tool;
- refilling elastic core paste material into the space between said dice and sidewall of the through hole of substrate;
- coating a die attaching material on dies back side and lower surface of said substrate;
- attaching a base on a lower surface of said substrate and dies;
- separating said die redistribution tool;
- coating a dielectric layer on the active surface of said die and upper surface of said substrate;
- forming an opening to expose a contact pad of said die and substrate;
- forming at least one conductive built tip layer over said dielectric layer;
- forming a contacting structure over said at least one conductive built up layer;
- forming a protection layer over said at least one conductive built up layer.
Dependencies are inferred from the claim text.