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US 2008/0157388 A1Published application
Semiconductor Device and Fabricating Method Thereof
OwnerJae Won Haninventor
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Abstract
A semiconductor device and fabricating method thereof are provided. A semiconductor substrate includes at least two holes for receiving devices, and at least two devices are inserted into the holes of the semiconductor substrate. Connection electrodes electrically connect the devices with each other, and the bonding pad portion provides signal connection between the connected devices and an outside device.
Claims20
A semiconductor device, comprising:
- a semiconductor substrate including at least two holes;
- at least two devices, wherein each device of the at least two devices is inserted into a hole of the at least two holes;
- at least one connection electrode for electrically connecting the at least two devices;
- and
- a bonding pad portion for signal connection between the at least two devices and an outside device.
2 more elements
A method for fabricating a semiconductor device, comprising:
- providing a semiconductor substrate including at least two holes;
- providing at least two devices;
- inserting each device of the at least two devices into a hole of the at least two holes;
- forming at least one connection electrode for electrically connecting the at least two devices;
- and
- forming a bonding pad portion for signal connection between the at least two devices and an outside device.
3 more elements
Dependencies are inferred from the claim text.