IC package having improved structure
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsMing-Lun(Simon) Szu, David Gregory Howell
Life of this patent
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Abstract
An electrical assembly (100) includes an IC package (1), a CPU connector and a heat sink (14). The IC package comprises a substrate (11), a die (12) generating heat and located on the substrate and having an upper surface (123), a lower surface and a pair of side walls (121) and end walls (122) connecting the upper surface and the lower surface, and a load distributor frame (13) surrounding side walls (121) and end walls (122) of the die and having a top surface (131), a bottom surface attached on the substrate, an inner surface (133) and an outer surface (134). The load distributor is distant to the die.
Claims11
A package comprising:
- a substrate;
- a die mounted on an upper surface of the substrate;
- and
- a load distributor frame mounted on the substrate and distant to the die.
An electrical assembly comprising:
- a connector assembly;
- an IC package mounted onto the connector, and including a load distributor with open frame in which a die is open to be accessed.
An electrical connector assembly comprising:
- a printed circuit board;
- an electronic package located above and electrically connected to the printed circuit board, said electronic package including:
- a substrate;
- a die located around a central area of an upper surface of the substrate;
- and
- load distributor structures formed on the upper surface of the substrate and being higher than the die;
- wherein
- the die is not covered by the lead distributor structures in a vertical direction.
Dependencies are inferred from the claim text.