Lead frame
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorTsing Chow WANG
Life of this patent
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Abstract
A lead frame comprises a die pad and leads arranged around the die pad. Through holes are provided in the die pad, and the through holes are located in the peripheries, i.e., margin area of the die pad. The through holes serve to be passed through by the metal wires connected with the leads. By means of the above-described lead frame, the subsequent packaging process of the semiconductor chip; including dual chips and/or multi-chips assembly, is simplified and the effect of the manufacturing process is improved, at the same time, the manufacturing cost is reduced.
Claims12
A lead frame comprising:
- a die pad;
- and
- leads arranged around the die pad,
- wherein said die pad includes through holes on the peripheries thereof, which through holes are used for metal wires connected with the leads to pass through.
Dependencies are inferred from the claim text.