Semiconductor device and manufacturing method thereof
AssigneeOki Electric Industry Co., Ltd.
InventorShunichi Tokitoh
Life of this patent
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Abstract
A semiconductor device includes a substrate, on which an element region and a peripheral region are defined. At least one function element is to be provided in the element region, and the peripheral region surrounds the element region. The semiconductor device also includes a layer of wiring. The semiconductor device also includes a seal ring having a ring portion that is provided in the peripheral region in the same layer as the wiring layer. The ring portion has a main body surrounding a chip region, and a plurality of portions protruding toward the element region from the seal ring main body.
Claims24
A semiconductor device comprising:
- at least one function element;
- a substrate, on which an element region and peripheral region are defined such that the at least one function element is provided in the element region and the peripheral region surrounds said element region;
- a first wiring layer which includes wiring provided in said element region;
- and
- a first seal ring including a ring portion that is provided in said peripheral region in the same layer as the first wiring layer, said ring portion having a main body surrounding said element region, and also having a plurality of protruding portions protruding toward said element region from said main body.
A semiconductor device comprising:
- a substrate, on which an element region and a peripheral region are defined such that at least one function element is to be provided in the element region and the peripheral region surrounds said element region;
- an insulating film provided on an upper surface of said substrate;
- a seal ring-specific trench that penetrates said insulating film;
- a wiring-specific trench that penetrates said insulating film;
- a first wiring layer provided in said element region so as to be embedded in said wiring-specific trench, said first wiring layer having wiring made from copper;
- and
- a first seal ring including a ring portion provided in said peripheral region so as to be embedded in the seal ring-specific trench,
- wherein said ring portion is provided in the same layer as said first wiring layer, and has a main body surrounding said element region, and a plurality of protruding portions protruding toward said element region from said seal ring main body.
Dependencies are inferred from the claim text.