Temperature control for performing heat process on resist film

An adjusting apparatus for acquiring adjustment information used for a temperature controller configured to control a temperature of a hot plate, so that respective measured temperatures of the hot plate at a plurality of measurement points conform to respective target temperatures, and to adjust the respective target temperatures by use of the adjustment information, in a heat processing apparatus for performing a heat process on a substrate placed on the hot plate, which is used in a coating/developing system for applying a resist coating onto the substrate to form a resist film and then performing development on the resist film after light exposure, the adjusting apparatus comprising:

• a calculating device configured to calculate the adjustment information for adjusting temperature of a substrate to a desired temperature state, by use of relation information showing a relation between the target temperatures and temperatures of the substrate and temperature distribution information of the substrate measured before adjustment of the target temperatures,
• wherein the calculating device comprises
• a first calculating portion for measuring a stepped response waveform of measured temperatures of the substrate at the plurality of measurement points while changing stepwise each target temperature, then using the measured stepped response waveform to compose a pulsed response waveform with respect to a change of a pulsed target temperature, then using the pulsed response waveform to compose a triangular response waveform with respect to a change of a triangular target temperature, and then using the triangular response waveform to acquire a matrix as relation information showing a relation between the target temperatures and temperatures of the substrate at the plurality of measurement points, and
• a second calculating portion for calculating the temperature distribution information by use of measured temperatures of the substrate measured at the plurality of measurement points before adjustment of the target temperatures.

A temperature controller for controlling a temperature of a hot plate, so that respective measured temperatures of the hot plate at a plurality of measurement points conform to respective target temperatures, in a heat processing apparatus for performing a heat process on a substrate placed on the hot plate, which is used in a coating/developing system for applying a resist coating onto the substrate to form a resist film and then performing development on the resist film after light exposure, the temperature controller comprising:

• a calculating device configured to calculate adjustment information for adjusting temperature of a substrate to a desired temperature state, by use of relation information showing a relation between the target temperatures and temperatures of the substrate,
• wherein the calculating device comprises
• a first calculating portion for measuring a stepped response waveform of measured temperatures of the substrate at the plurality of measurement points while changing stepwise each target temperature, then using the measured stepped response waveform to compose a pulsed response waveform with respect to a change of a pulsed target temperature, then using the pulsed response waveform to compose a triangular response waveform with respect to a change of a triangular target temperature, and then using the triangular response waveform to acquire a matrix as relation information showing a relation between the target temperatures and temperatures of the substrate at the plurality of measurement points, and
• a second calculating portion for calculating the temperature distribution information by use of measured temperatures of the substrate measured at the plurality of measurement points before adjustment of the target temperatures.

A computer readable storage medium that stores a program for execution on a computer, for acquiring adjustment information used for a temperature controller configured to control a temperature of a hot plate, so that respective measured temperatures of the hot plate at a plurality of measurement points conform to respective target temperatures, and to adjust the respective target temperatures by use of the adjustment information, in a heat processing apparatus for performing a heat process on a substrate placed on the hot plate, which is used in a coating/developing system for applying a resist coating onto the substrate to form a resist film and then performing development on the resist film after light exposure, wherein the program causes the computer to execute:

• a first procedure of using a stepped response waveform of measured temperatures of a substrate, measured at the plurality of measurement points while changing stepwise each target temperature, to compose a pulsed response waveform with respect to a change of a pulsed target temperature, then using the pulsed response waveform to compose a triangular response waveform with respect to a change of a triangular target temperature, and then using the triangular response waveform to acquire a matrix as relation information showing a relation between the target temperatures and temperatures of the substrate at the plurality of measurement points, and
• a second procedure of calculating temperature distribution information by use of measured temperatures of the substrate measured at the plurality of measurement points before adjustment of the target temperatures, and then calculating adjustment information for adjusting temperature of the substrate to a desired temperature state, by use of the relation information acquired in the first procedure and the temperature distribution information.