Process for sputtering aluminum or copper onto aluminum or magnalium alloy substrates
OwnerShuixiang Huanginventor
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Abstract
A method of sputtering a metal substance onto at substrate selected from the group consisting of at least one of aluminum and magnalium alloy, includes the steps of: cleaning a surface of the substrate by tap water and R.O. water; coating a base coat on the surface of the substrate; coating a media coat over the base coat, wherein the media coat includes a mixture of poly-butadiene resin, alkyd, and toluene; sputtering the metal substance over the media coat by Physical Vapor Deposition (PVD) process to form a metal layer on the media coat, wherein the metal substance is selected from the group consisting of aluminum and copper; and coating a top coat over the metal layer.
Claims20
A method of sputtering a metal substance onto a substrate selected from the group consisting of aluminum and magnalium alloy, comprising the steps of:
- (a) coating a base coat on a surface of said substrate;
- (b) coating a media coat over said base coat, wherein said media coat comprises a mixture of poly-butadiene resin, alkyd, and toluene;
- (c) sputtering said metal substance over said media coat by Physical Vapor Deposition (PVD) process to form a metal layer oil said media coat, wherein said metal substance is selected from the group consisting of aluminum and copper;
- and
- (d) coating a top coat over said metal layer.
Dependencies are inferred from the claim text.