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US 2008/0156475 A1Published application
Thermal interfaces in electronic systems
OwnerDaewoong Suhinventor
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Abstract
In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an indium alloy.
Claims14
An apparatus, comprising:
- a semiconductor device;
- and
- a heat dissipation assembly;
- and
- a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an indium alloy.
2 more elements
A system, comprising:
- a display;
- a processor coupled to a printed circuit board;
- a heat dissipation assembly;
- a semiconductor device;
- a heat dissipation assembly;
- and
- a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an indium alloy.
4 more elements
Dependencies are inferred from the claim text.