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US 2008/0156260 A1Published application
Wafer Support and Method of Making Wafer Support
AssigneeMEMC Electronic Materials, Inc.
InventorsLarry W. Shive, Brian L. Gilmore
Life of this patent
Estimating the term…
Abstract
A wafer support platform is sandblasted with silicon-containing particles to create a surface with uniform roughness. Contaminants become embedded in the surface during the sandblasting procedure. A layer is applied over the surface to isolate the contaminants from a support wafer while maintaining the uniform roughness.
Claims17
A method of preparing a wafer support platform to be used for supporting a semiconductor wafer during treatment, said method comprising
- sandblasting a surface of the platform to reduce slip of the supported wafer during treatment, wherein the sandblasting introduces contaminants on the surface of the platform,
- applying a layer of a material on the surface of the platform after said sandblasting to prevent the contaminants from diffusing into the supported wafer during treatment.
A wafer support platform comprising
- a main body having a surface modified by sandblasting,
- contaminants from sandblasting embedded in the surface of the body,
- a layer of material overlying the contaminants on said surface of the body to prevent the contaminants from diffusing into the supported wafer during treatment.
Dependencies are inferred from the claim text.