US 2008/0150050 A1 · Information sensing device and method of manufacturing the same

Abstract

An information sensing device includes a substrate, an information sensing chip mounted on and electrically connected to the substrate, at least one electroconductive structure mounted on and electrically connected to the substrate and disposed on one side of the information sensing chip, and a molding compound material partially surrounding the information sensing chip and the electroconductive structure to expose a chip surface of the information sensing chip and a first surface of the electroconductive structure. Thus, an electrostatic charge approaching the information sensing device is conducted from the electroconductive structure to the substrate. The chip surface is to be in contact with an object to sense an image of the object.

Claims18

Dependent claims

An information sensing device, comprising:

a substrate, on which an electrical output portion comprising a plurality of output connections is formed, the electrical output portion being to be electrically connected to a circuit board;
one information sensing chip mounted on the substrate and electrically connected to the electrical output portion of the substrate, wherein the information sensing chip is to be close to or in contact with an object to sense specific information of the object;
at least one electroconductive structure electrically connected to the electrical output portion of the substrate;
and
a molded body, which is in contact with the information sensing chip and the at least one electroconductive structure to expose a chip surface of the information sensing chip and a first surface of the at least one electroconductive structure.

2 more elements

Dependencies are inferred from the claim text.

Information sensing device and method of manufacturing the same

Life of this patent

Information sensing device and method of manufacturing the same

Life of this patent

Abstract

Claims18