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US 2008/0076330 A1Published application
Chemical mechanical polishing with napped poromeric
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Lawrence Rosenberg, Sasson Somekh, John White
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Abstract
A method of polishing a substrate includes polishing a substrate with a generally linear polishing sheet, polishing the substrate with polishing pad composed of a napped poromeric material, and conditioning the polishing pad.
Claims17
A chemical mechanical polishing apparatus, comprising:
- a first polishing station including
- a movable platen,
- a generally linear polishing sheet, and
- a drive mechanism supporting the polishing sheet with a portion of the polishing sheet extending over the platen, the drive mechanism configured to incrementally advance the polishing sheet in a linear direction relative to the platen;
- and
- a second polishing station including
- a rotatable platen,
- a polishing pad composed of a napped poromeric material attached to the rotatable platen;
- and
- a conditioner having a conditioner head to condition the polishing pad.
7 more elements
A method of polishing a substrate, comprising:
- polishing a substrate with a generally linear polishing sheet;
- polishing the substrate with polishing pad composed of a napped poromeric material;
- and
- conditioning the polishing pad.
1 more element
An assembly for a chemical mechanical polisher, comprising:
- a roller;
- a first generally linear polishing sheet wound around the roller;
- a second generally linear polishing sheet wound around the roller and spaced apart from the first polishing sheet.
Dependencies are inferred from the claim text.