Polishing slurry and polishing method using same
AssigneeNihon Micro Coating Co., Ltd.
InventorsKazuei Yamaguchi, Yasuyuki Yokota, Sanaki Horimoto
Life of this patent
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Abstract
Polishing slurry is caused to be present between a surface of a soft magnetic layer and a polishing tool such as a polishing pad and the surface of the soft magnetic layer and the polishing tool are moved relative to each other. The polishing slurry contains silica particles as abrading particles, compounds containing carboxylic acid and amino polycarboxylic acid and an oxidizing agent as a polishing accelerator, organic and/or inorganic compound of phosphoric acid, nitride and/or nitrite as an anti-corrosion agent and a pH conditioner such that the slurry has pH value between 4 and 11.
Claims12
Polishing slurry for polishing the surface of a soft magnetic layer formed on the surface of a substrate for a perpendicular magnetic recording hard disk, said polishing slurry comprising:
- abrading particles;
- a polishing accelerator;
- an anti-corrosion agent;
- a pH conditioner;
- and
- water;
- wherein said abrading particles include silica particles;
- wherein said polishing accelerator includes a compound containing carboxylic acid, a compound containing amino polycarboxylic acid and an oxidizing agent;
- wherein said anti-corrosion agent includes one or more compounds selected from the group consisting of organic and inorganic compounds of phosphoric acid, nitrides and nitrites;
- and
- wherein said polishing slurry is conditioned to be between pH4 and pH 11 by said pH conditioner.
A method of polishing the surface of a soft magnetic layer formed on the surface of a substrate for a perpendicular magnetic recording hard disk;
- said method comprising the steps of:
- causing polishing slurry to be present between said surface of said soft magnetic layer and a polishing tool;
- and
- causing said surface of said soft magnetic layer and said polishing tool to move relative to each other;
- wherein said polishing slurry comprises:
- abrading particles;
- a polishing accelerator;
- an anti-corrosion agent;
- a pH conditioner;
- and
- water;
- wherein said abrading particles include silica particles;
- wherein said polishing accelerator includes a compound containing carboxylic acid, a compound containing amino polycarboxylic acid and an oxidizing agent;
- wherein said anti-corrosion agent includes one or more compounds selected from the group consisting of organic and inorganic compounds of phosphoric acid, nitrides and nitrites;
- and
- wherein said polishing slurry is conditioned to be between pH4 and pH11 by said pH conditioner.
Dependencies are inferred from the claim text.