Method of reducing electron beam damage on post W-CMP wafers
AssigneeMicron Technology, Inc.
InventorsDavid A. Daycock, Paul A. Morgan, Shawn D. Lyonsmith, Curtis R. Olson
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Abstract
Methods for reducing electron beam induced damage on semiconductor substrates employ compositions such as small chain organic solvents and non-neutral pH solutions to reduce or eliminate charge imbalances on semiconductor substrates caused by electron beam inspection of the semiconductor substrates. Damage to semiconductor substrates by electron beam inspection processes may also be reduced by generating or otherwise forming passivation films on a semiconductor substrate following electron beam inspection.
Claims27
A method of reducing a charge imbalance on a semiconductor substrate, comprising exposing the semiconductor substrate to a charge imbalance correcting composition.
A method for reducing damage to an electron beam inspected semiconductor substrate, comprising treating the electron beam inspected semiconductor substrate with a passivation plasma.
A method of inspecting a semiconductor substrate during fabrication, comprising:
- exposing the semiconductor substrate to an electron beam inspection process;
- and treating the semiconductor substrate with a passivating composition.
Dependencies are inferred from the claim text.