Method for fabricating capacitor of semiconductor device
AssigneeHynix Semiconductor Inc.
InventorsDong-Woo SHIN, Hyung-Bok Choi, Jong-Min Lee, Jin-Woong Kim
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AssigneeHynix Semiconductor Inc.
InventorsDong-Woo SHIN, Hyung-Bok Choi, Jong-Min Lee, Jin-Woong Kim
Estimating the term…
The present invention relates to a method for fabricating a capacitor of a semiconductor device. The method includes the steps of: forming a first amorphous silicon layer doped with an impurity in a predetermined first doping concentration suppressing dopants from locally agglomerating; forming an impurity undoped second amorphous silicon layer on the first amorphous silicon layer in an in-situ condition; forming a storage node by patterning the first amorphous silicon layer and the second amorphous silicon layer; forming silicon grains on a surface of the storage node; and doping the impurity to the storage node and the silicon grains until reaching a second predetermined concentration for providing conductivity required by the storage node.
1-4. (canceled)
The method as recited in claim 1, wherein the step of doping the impurity onto the storage node and the silicon grains proceeds by performing another doping method of a furnace annealing in an atmosphere of a gas containing phosphorus.
The method as recited in claim 1, wherein the step of doping the impurity onto the storage node and the silicon grains further includes the steps of:
10-11. (canceled)
A method for fabricating a capacitor of a semiconductor device, comprising the steps of:
Dependencies are inferred from the claim text.