Method for producing flexible integrated circuits which may be provided contiguously

A method for producing electronic assemblies with packaged integrated circuits which are mechanically flexible and can be provided contiguously on a common carrier substrate, comprising:

• continuously providing the flexible packaged integrated circuits, the flexible packaged integrated circuits being arranged between first and second flexible substrates and connected to conductor-line patterns of the first flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible, and
• mounting one of the provided packaged integrated circuits on one of the electronic assemblies, comprising the following sub-steps:
• mechanically and electrically connecting the one packaged integrated circuit to the one electronic assembly;
• and
• separating the packaged electrical circuit from the packaged integrated circuits supplied contiguously.

A method for producing packaged integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate, comprising:

• continuously providing a first flexible substrate having conductor-line patterns,
• mounting the flexible integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and
• covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided or generated in the second flexible substrate in order to make the conductor-line patterns of the first flexible substrate accessible, comprising the following sub-steps:
• continuously providing a flexible film as the second flexible substrate with or without recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or
• applying, by a printing technique, a cover as the second flexible substrate to the flexible integrated circuits mounted on the first flexible substrate.