Deposition apparatus, deposition method, method of manufacturing liquid crystal device
AssigneeSeiko Epson Corporation
InventorHiroyuki Kojima
Life of this patent
Estimating the term…
Abstract
There is provided a method of manufacturing a liquid crystal device, in which an inorganic alignment film is deposited on the surface of a substrate by allowing a vapor, which is generated by heating a deposition material, to reach the surface of the substrate through a slit hole so as to form a predetermined angle, the substrate being opposed to the deposition material with a mask having the slit hole interposed therebetween and moving in two opposite directions, wherein the inorganic alignment film is selectively deposited only when the substrate moves in one direction of the two opposite directions.
Claims12
A method of manufacturing a liquid crystal device, in which an inorganic alignment film is deposited on the surface of a substrate by allowing a vapor, which is generated by heating a deposition material, to reach the surface of the substrate through a slit hole so as to form a predetermined angle, the substrate being opposed to the deposition material with a mask having the slit hole interposed therebetween and moving in two opposite directions,
- wherein the inorganic alignment film is selectively deposited only when the substrate moves in one direction of the two opposite directions.
A deposition apparatus for forming a thin film on a surface of a substrate by allowing vapor generated by heating a deposition material in a vacuum chamber to reach the surface of the substrate, the deposition apparatus comprising:
- an attachment-preventing plate having a conical or pyramidal opening formed toward the deposition material, being enlarged in an opening direction, and having a slit hole extending toward the opening in a side surface thereof;
- and
- a substrate support portion supporting the substrate so that the substrate is opposed to an outer surface of the attachment-preventing plate and the substrate is opposed to the deposition material at a predetermined angle,
- wherein the thin film is formed on the substrate by relatively rotating the attachment-preventing plate relative to the substrate support portion about a straight line passing through the center of the deposition material, and allowing the substrate supported by the substrate support portion to be exposed to the deposition material through the slit hole.
A deposition apparatus for forming a thin film on a surface of a substrate by allowing vapor generated by heating a deposition material in a vacuum chamber to reach the surface of the substrate, the deposition apparatus comprising:
- an attachment-preventing plate having a conical or pyramidal opening formed toward the deposition material, being enlarged in an opening direction, and having a slit hole extending toward the opening in a side surface thereof;
- and
- a substrate support portion supporting the substrate so that the substrate is opposed to an outer surface of the attachment-preventing plate and the substrate is opposed to the deposition material at a predetermined angle,
- wherein the thin film is formed on the substrate by relatively rotating the attachment-preventing plate relative to the substrate support portion in one direction about a straight line passing through the center of the deposition material, and allowing the substrate supported by the substrate support portion to be exposed to the deposition material through the slit hole.
Dependencies are inferred from the claim text.