Method of cleaning reaction chamber, method of forming protection film and protection wafer
AssigneeUnited Microelectronics Corp.
InventorsChih-Jen Mao, Chun-Hung Hsia, Ta-Ching Yang, Chun-Cheng Yu, Chien-Fu Chu, Kuo-Wei Yang, Chun-Han Chuang, Hui-Shen Shih
Life of this patent
Estimating the term…
Abstract
A method of cleaning a reaction chamber having a wafer holder is provided. First, the reaction chamber is cleaned by a cleaning gas. Next, a protection film is formed on the inner surface of the reaction chamber, wherein a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided therebetween simultaneously.
Claims26
A method of cleaning a reaction chamber, the reaction chamber having a wafer holder, the method comprising the following steps:
- cleaning the reaction chamber using a cleaning gas;
- and
- forming a protection film on an inner surface of the reaction chamber, wherein when forming the protection film, a protection wafer is provided above the wafer holder so that a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided between the protection wafer and the wafer holder simultaneously.
A protection wafer, suitable for a cleaning process of a reaction chamber, the reaction chamber having a wafer holder, the wafer holder comprising a supporting surface and a lateral surface connected to a periphery of the supporting surface, the protection wafer comprising:
- a first covering body, covering the supporting surface of the wafer holder;
- and
- a second covering body, connected to a periphery of the first covering body, to cover the lateral surface connected to the periphery of the supporting surface.
A method of forming a protection film, suitable for forming a protection film on an inner surface of a reaction chamber, the reaction chamber having a wafer holder, the method comprising:
- providing a protection wafer above the wafer holder when forming the protection film, wherein a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided between the protection wafer and the wafer holder simultaneously.
Dependencies are inferred from the claim text.