Apparatus and methods for the inspection of microvias in printed circuit boards
AssigneeHitachi Via Mechanics, Ltd.
InventorTodd E. Lizotte
Life of this patent
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Abstract
An imaging method and imaging system for inspecting features located at a known inter-feature pitch on portions of a target surface. The system includes a lens array having a plurality of lenses wherein the lenses of the lens array have an inter-lens pitch and an inter-field of view pitch corresponding to the inter-feature pitch, and an array of imaging elements having an inter-element pitch corresponding to the inter-feature pitch, whereby the imaging system images only field of view areas of the target surface containing features.
Claims12
An imaging system for inspecting features located at a known inter-feature pitch on portions of a target surface, comprising:
- a lens array having a plurality of lenses,
- the lenses of the lens array having
- an inter-lens pitch and an inter-field of view pitch corresponding to the inter-feature pitch, and
- an array of imaging elements having an inter-element pitch corresponding to the inter-feature pitch, whereby
- the imaging system images only field of view areas of the target surface containing features.
Dependencies are inferred from the claim text.