Near-field exposure method and apparatus, near-field exposure mask, and device manufacturing method

A near-field exposure apparatus for performing exposure on the basis of near field light, said apparatus comprising

• means for holding a thin film mask;
• a pressure container capable of applying pressure to apply a pressure difference between a front face and rear face of the thin film mask;
• control means for controlling the pressure difference;
• a stage for holding a substrate to be exposed;
• and
• a light source,
• wherein said control means is operable to set the pressure difference at a predetermined pressure difference corresponding to a surface roughness of the substrate to be exposed.

A near-field exposure mask to be used in an exposure process based on near field light while a pressure difference is applied between a front face and a rear face of an elastically deformable exposure mask to cause deformation in accordance with a substrate to be exposed and to cause the mask to follow a surface irregularity state of the substrate so that these surfaces are closely contacted to each other, said exposure mask comprising:

• a transparent thin-film mask base material;
• and
• a light blocking film formed therein,
• wherein the thin-film mask base material has a predetermined thickness determined on the basis of a surface roughness of the substrate to be exposed and a pressure difference to be applied between the front and rear faces of the mask during the exposure.

A device manufacturing method, comprising:

• a preparing step for preparing a substrate for device production;
• an applying step for applying a photosensitive resist, for exposure, to the substrate to thereby provide a substrate to be exposed;
• an exposure step wherein a pressure difference is applied between a front face and a rear face of an elastically deformable exposure mask to cause deformation of the exposure mask relative to the substrate to be exposed and to cause the exposure mask surface to follow the surface irregularity state of the substrate to be exposed, so that these surfaces are in close contact with each other for exposure based on near field light, and wherein the pressure difference to be applied between the front and rear faces of the exposure mask for the exposure is set at a predetermined pressure difference corresponding to a surface roughness of the substrate to be exposed;
• a developing and etching step for performing development and etching to the substrate having been exposed;
• and
• a process step for performing a predetermined process to the substrate in accordance with a device to be produced, whereby a device is produced.