Method of manufacturing semiconductor device
AssigneesFujitsu Limited, The University of Tokyo
InventorsYasuhiko Arakawa, Denis Guimard, Shiro Tsukamoto, Hiroji Ebe, Mitsuru Sugawara
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AssigneesFujitsu Limited, The University of Tokyo
InventorsYasuhiko Arakawa, Denis Guimard, Shiro Tsukamoto, Hiroji Ebe, Mitsuru Sugawara
Estimating the term…
The method of manufacturing the semiconductor device comprises the step of forming quantum dots 16 on a base layer 10 by self-assembled growth; the step of irradiating Sb or GaSb to the surface of the base layer 10 before or in the step of forming quantum dots 16; the step of etching the surfaces of the quantum dots 16 with an As raw material gas to thereby remove an InSb layer 18 containing Sb deposited on the surfaces of the quantum dots 16; and growing a capping layer 22 on the quantum dots 16 with the InSb layer 18 removed.
A method of manufacturing a semiconductor. device comprising the steps of:
A method of manufacturing a semiconductor device comprising the steps of:
A method of manufacturing a semiconductor device comprising the step of:
A method of manufacturing a semiconductor device comprising the step of
A semiconductor device comprising:
Dependencies are inferred from the claim text.