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US 2008/0073407 A1Published application
Deep access large ribbon bond head
AssigneeOrthodyne Electronics Corporation
InventorTheodore J. Copperthite
Life of this patent
Estimating the term…
Abstract
A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm with an opening, where the bonding ribbon passes through, not around, the clamp arm. The ribbon is clamped between the movable clamp and the stationary clamp and held securely during looping.
Claims17
A ribbon bond head, comprising:
- a main body;
- a ribbon guide tube having a first end coupled to the main body and a second end coupled to a ribbon source, wherein the ribbon guide tube has an opening to enclose and pass through a conductive ribbon;
- a transducer coupled to the main body;
- an opening in the main body in front of the transducer, wherein the ribbon passes through the opening and in front of the transducer;
- and
- a clamp coupled to the main body, wherein the clamp comprises:
- a clamp arm having a width at least as wide as the ribbon;
- and
- a stationary clamp base having a width at least as wide as the ribbon.
6 more elements
A method for bonding a conductive ribbon to a bond area, comprising:
- passing the ribbon in front of a transducer;
- and
- clamping the ribbon through a stationary clamp base and a clamp arm.
Dependencies are inferred from the claim text.