Metal cage structure and method for EMI shielding
AssigneeAdvanced Micro Devices, Inc.
InventorsMayank Gupta, Mario Pelella, Farzin Assad
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Abstract
According to one exemplary embodiment, a structure comprises an electronic device situated over a substrate of a semiconductor die. The structure further includes a metal cage comprising a number of contacts situated over the substrate and surrounding the electronic device. The contacts form a lateral EMI shield portion of the metal cage. The structure also includes a number of vias connecting a number of metal interconnect segments to the contacts. The metal interconnect segments form a top EMI shield portion of the metal cage.
Claims20
A structure situated in a semiconductor die, said structure comprising:
- an electronic device situated over a substrate of said semiconductor die;
- a metal cage comprising a plurality of contacts situated over said substrate and surrounding said electronic device, said plurality of contacts forming a lateral EMI shield portion of said metal cage.
A method of shielding an electronic device from electromagnetic interference, said method comprising steps of:
- forming said electronic device over a substrate of a semiconductor die;
- forming a lateral EMI shield portion of a metal cage, said lateral EMI shield portion comprising a plurality of contacts and a plurality of vias, said plurality of contacts and said plurality of vias situated over said substrate and surrounding said electronic device.
A circuit board comprising a structure situated in a semiconductor die, said structure comprising:
- an electronic device situated over a substrate of said semiconductor die;
- a metal cage comprising a plurality of contacts situated over said substrate and surrounding said electronic device, said plurality of contacts forming a lateral EMI shield portion of said metal cage.
Dependencies are inferred from the claim text.