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US 2008/0073111 A1Published application
Single Package Multiple Component Array With Ball Grid Array Mounting and Contact Interface
AssigneeVlsip Technologies, Inc.
InventorElmer Albert Wolff
Life of this patent
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Abstract
The present invention includes an apparatus and methods of making a modular system that includes a substrate having two or more conductive pads; one or more first surface mounted electronic components being electrically connected to the conductive pads; and one or more second surface mounted electronic components electrically connected in parallel with the first by solder bonding to the first surface mounted electronic component.
Claims27
A modular system comprising:
- a substrate comprising two or more conductive pads;
- one or more first surface mounted electronic components being electrically connected to the conductive pads;
- and
- one or more second surface mounted electronic components electrically connected in parallel with the first by solder bonding to the first surface mounted electronic component.
1 more element
A modular capacitor array comprising:
- substrate comprising a two or more pairs of conductive pads on the substrate;
- two or more first surface mounted capacitors being electrically connected, each to one of the pairs of conductive pads;
- and
- two or more second surface mounted capacitor electrically connected in parallel with the first by solder bonding, wherein the first and second surface mounted capacitors double the capacitance of the capacitors, wherein the array comprises single, double, or n levels of capacitors.
1 more element
A method for reducing the footprint of a capacitor array comprising:
- electrically connecting one or more first surface mounted capacitors on a pair of conductive pads on a substrate;
- and
- electrically connecting one or more second surface mounted capacitor with the first in parallel by solder bonding to the first surface mounted capacitor, wherein the first and second surface mounted capacitors double the capacitance of the capacitors.
Dependencies are inferred from the claim text.