Surface mounting type electronic components and manufacturing method of the same
AssigneeTaiyo Yuden Co., Ltd.
InventorsKenji Saito, Kohzo Yogiashi
Life of this patent
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Abstract
One inventive aspect relates to a surface mounting type electronic component excellent in a mounting property and having desired equivalent series resistance (ESR). The component has an electronic component body, and at least a pair of terminal electrodes formed on a surface of the electronic component body. The terminal electrode has a conductive resin layer formed between a substrate metal layer and a metal plating layer. The first and second layers each comprise a curable resin and metal particles. The first layer is lower in the content of metal particles than the second layer.
Claims8
A surface mounting type electronic component having an element assembly of electronic components comprising internal electrodes buried inside the element assembly of a substantially hexahedral form, and at least a pair of end termination electrodes formed on the surface where the internal electrodes of the element assembly of electronic components are exposed and electrically connecting to the internal electrodes,
- wherein each end termination electrode has a substrate metal layer connecting to the internal electrode and adhering to the surface of the element assembly of electronic components, a conductive resin layer formed on the substrate metal layer and comprising a curable resin and metal particles, and at least one metal plating layer formed on the conductive resin layer, and
- the conductive resin layer is in layers of two or more resins different in the content of metal particles, and a first resin layer on the side of the substrate metal layer is lower in the content of metal particles than a second resin layer on which the metal plating layer is formed.
A method of manufacturing a surface mounting type electronic component comprising
- preparing an element assembly of an electronic component comprising a substrate metal layer connecting to an internal electrode of the element assembly,
- forming a conductive resin layer comprising a curable resin and metal particles on the substrate metal layer, and
- forming a metal plating layer on the conductive resin layer,
- wherein the forming of the conductive resin layer comprises forming a first resin layer on the substrate metal layer, and forming a second resin layer higher in the content of metal particles than the first resin layer.
A surface-mounting electronic component having an electronic component body, and at least a pair of terminal electrodes formed on a surface of the electronic component body, at least one of the terminal electrodes comprising:
- a conductive resin layer formed between a substrate metal layer and a metal plating layer, the substrate metal layer connecting to internal electrodes of the electronic component body, the conductive resin layer comprising at least a first resin layer adjoining the substrate metal layer and a second resin layer adjoining the metal plating layer, the first and second layers each comprising a curable resin and metal particles, wherein the first layer is lower in the content of metal particles than the second layer.
A terminal electrode suitable for being used in surface-mounting electronic component, the terminal electrode comprising:
- a conductive resin layer formed between a substrate metal layer and a metal plating layer, the conductive resin layer comprising at least a first and second resin layer, the first and second layers each comprising a curable resin and metal particles, wherein the first layer is lower in the content of metal particles than the second layer.
Dependencies are inferred from the claim text.