Apparatus for manufacturing semiconductor device

Abstract

An apparatus according to the present invention, includes an etching solution tank which contains etching solution used for a wet etching process, a wet etching process to a semiconductor wafer being carried out in the etching solution tank; a nitrogen gas supply component which supplies a nitrogen gas (N2), which is used for a wet etching process in the etching solution tank; a flow regulating component which delivers the nitrogen gas (N2) supplied from said nitrogen gas supply component into said etching solution tank during a wet etching process, and which continues to deliver said nitrogen gas into said etching solution tank during a standby phase in which a wet etching process is not being performed; and a bubbling component which bubbles said nitrogen gas (N2), supplied from said nitrogen gas supply component, in said etching solution tank during a wet etching process.

Dependencies are inferred from the claim text.