Stacked Contact Bump
AssigneeTouchdown Technologies, Inc.
InventorsRichard Yabuki, Nim Tea
Life of this patent
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Abstract
A novel method for providing bump structures that can be formed by conventional stud bump bonding techniques is disclosed. The bumps can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.
Claims25
A buttressed bump structure comprising:
- a bonding surface that defines a bond plane;
- and
- a bottom tier comprised of a plurality of bottom bumps connected to the bonding surface and arranged in a buttressed configuration that is parallel to the bond plane.
A method of constructing a buttressed bump structure comprising the steps of:
- providing a bonding pad;
- forming on the bonding pad a bottom tier, wherein the bottom tier comprises a plurality of bottom bumps arranged in a buttressed configuration;
- coining the bottom tier;
- and
- forming on top of the bottom tier a second tier, wherein the second tier comprises a second plurality of bumps arranged in a buttressed configuration.
Dependencies are inferred from the claim text.