Wafer removing force reduction on cmp tool
OwnerManoj Balachandran, James Hagan +4inventors
InventorsManoj Balachandran, James Hagan, Ben Kim, Deoram Persaud, Adam Ticknor, Wei-Tsu Tseng
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Abstract
Reduction of a wafer removing force on a chemical mechanical planarization (CMP) tool that includes planarizing a wafer on a platen at a wafer/platen interface; applying carbonated water to the wafer/platen interface so as to reduce the removing force; and removing the wafer from the platen.
Claims20
A method of reducing wafer removing force on a chemical mechanical planarization (CMP) tool, comprising the steps of:
- planarizing a wafer on a platen at a wafer/platen interface;
- applying carbonated water to the wafer/platen interface to reduce the removing force;
- and
- removing the wafer from the platen.
A system for reducing wafer removing force on a chemical mechanical planarization (CMP) tool, comprising:
- means for planarizing a wafer on a platen at a wafer/platen interface;
- means for applying carbonated water to the wafer/platen interface;
- and
- means for removing wafer from platen.
A method of reducing wafer removing force on a chemical mechanical planarization (CMP) tool, comprising the steps of:
- planarizing a wafer on a platen at a wafer/platen interface;
- applying pressurized carbonated deionized water that is between approximately 40 and 50 degrees Fahrenheit to the wafer/platen interface, to reduce wafer removing force;
- and
- removing the wafer from the platen.
Dependencies are inferred from the claim text.