Method for fabricating a metal-insulator-metal capacitor
AssigneeElectronics and Telecommunications Research Institute
InventorJune Lee
Life of this patent
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Abstract
A method fabricating multiple wiring metals in a semiconductor device. The method includes forming a lower wiring metal on a semiconductor substrate, forming an interlayer dielectric on the lower wiring metal, and selectively removing the interlayer dielectric to form a contact dielectric film, a body dielectric film and an opening between the contact and body dielectric films. The method also includes filling the opening with low-k material, forming a capping dielectric on the contact and body dielectric films and the low-k material, forming a contact hole passing through the capping dielectric and the contact dielectric film to be connected to the lower wiring metal, and forming an upper wiring metal electrically interconnected to the lower wiring metal through the contact hole.
Claims13
1-4. (canceled)
A multiple wiring metal structure comprising:
- a lower wiring metal formed on a semiconductor substrate;
- a contact dielectric film and a body dielectric film formed on the lower wiring metal;
- a low-k dielectric adapted to fill an opening between the contact and body dielectric films;
- a capping dielectric formed on the contact and body dielectric films;
- and
- an upper wiring metal connected to the lower wiring metal by a contact plug.
A multiple wiring metal structure comprising:
- a lower wiring metal formed on a semiconductor substrate;
- a dielectric layer formed on an upper surface of said lower wiring metal;
- a plurality of contact dielectric film and a plurality of body dielectric film formed on said dielectric layer;
- a low-k dielectric adapted to be filled in a plurality of openings defined between each of said body dielectric films and between at least one of said body dielectric film and said contact dielectric film;
- a capping dielectric formed on said contact and body dielectric films;
- and
- an upper wiring metal connected to the lower wiring metal by a contact plug.
Dependencies are inferred from the claim text.