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US 2007/0190698 A1Published application
Method of edge bevel rinse
AssigneeTouch Micro-System Technology Inc.
InventorsShih-Min Huang, Sh-Pei Yang
Life of this patent
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Abstract
A method of edge bevel rinse. First, a wafer having a coating material layer disposed thereon is provided. A light beam is optically projected on the wafer to form a reference pattern. The reference pattern defines a central region, and a bevel region surrounding the central region on the surface of the wafer. Subsequently, the coating material layer positioned in the bevel region is removed according to the reference pattern.
Claims11
A method of edge bevel rinse, comprising:
- providing a wafer having a coating material layer disposed thereon;
- optically projecting a light beam on the wafer to form a reference pattern, the reference pattern defining a central region on a surface of the wafer, and a bevel region surrounding the central region;
- and
- removing the coating material layer positioned in the bevel region according to the reference pattern.
1 more element
A method of edge bevel rinse, comprising:
- providing a wafer having a coating material layer disposed thereon;
- optically projecting a light beam on the wafer to form a reference pattern, the reference pattern defining a central region on a surface of the wafer, and a bevel region surrounding the central region;
- and
- spinning the wafer;
- and
- manually injecting a chemical medicament in the bevel region.
3 more elements
Dependencies are inferred from the claim text.