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US 2007/0190695 A1Published application
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
AssigneeIntel Corporation
InventorsAlan Myers, R. List, Gilroy Vandentop
Life of this patent
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Abstract
A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package.
Claims10
A method for cooling an electronics chip on a substrate with a first face thereof having circuitry thereon, and an opposite second face, the method comprising:
- pumping a cooling fluid thermally coupled to the second face with one or more electro-osmotic pumps positioned over the second face.
A method comprising:
- providing an electronics chip having a substrate with a first face having circuitry thereon, and an opposite second face;
- and
- providing at least one layer of material over the second face, one of the at least one layers forming at least one electro-osmotic pump.
Dependencies are inferred from the claim text.