Substrate processing method, substrate processing apparatus, and manufacturing method of semiconductor device

A substrate processing apparatus comprising:

• a substrate housing chamber in which a processing target substrate to be applied with exposure treatment is housed prior to providing a resist film on a first main face at a side at which the exposure treatment is applied;
• a substrate support unit which exposes a region in a predetermined range from a peripheral rim part of a second main face opposite to at least the first main face in the substrate housing chamber, and supports the processing target substrate;
• and
• a substrate treating agent supply device which supplies a hydrophobic treating agent into the substrate housing chamber.

A manufacturing method of a semiconductor device wherein the method including a liquid immersion exposure method for carrying out exposure treatment while supplying a liquid between a processing target substrate to be applied with the exposure treatment and a projection optical system of an exposure device for carrying out the exposure treatment, comprising:

• providing a resist film on which a predetermined resist pattern is formed by the exposure treatment on a first main face of the processing target substrate at a side to be applied with the exposure treatment;
• providing a cover film on the resist film;
• and
• selectively applying the exposure treatment via a mask to the processing target substrate having the cover film provided thereon, and prior to providing the resist film on the first main face, selectively applying at least hydrophobic treatment to a region in a predetermined range from a peripheral rim part of a second main face opposite to the first main face of the processing target substrate.

A manufacturing method of a semiconductor device wherein the method including a liquid immersion exposure method for carrying out exposure treatment while supplying a liquid between a processing target substrate to be applied with the exposure treatment and a projection optical system of an exposure device for carrying out the exposure treatment, comprising:

• providing a resist film on which a predetermined resist pattern is formed by the exposure treatment on a first main face of the processing target substrate at a side to be applied with the exposure treatment;
• providing a cover film on the resist film;
• and
• selectively applying the exposure treatment via a mask to the processing target substrate having the cover film provided thereon, and prior to providing the resist film on the first main face, selectively applying at least hydrophobic treatment to a region in a predetermined range from a peripheral rim part of a second main face opposite to the first main face of the processing target substrate by use of a substrate processing apparatus, the substrate processing apparatus comprising:
• a substrate housing chamber in which a processing target substrate to be applied with exposure treatment is housed prior to providing a resist film on a first face at a side to be applied with the exposure;
• a substrate support unit which exposes a region in a predetermined range from a peripheral rim part of a second main face opposite to at least the first main face in the substrate housing chamber, and supports the processing target substrate;
• and
• a substrate treating agent supply device which supplies a hydrophobic treating agent into the substrate housing chamber.