Resist composition and patterning process using the same
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMutsuo Nakashima, Yoshitaka Hamada, Katsuya Takemura, Kazumi Noda
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Abstract
A resist composition is provided comprising a silicone resin, a photoacid generator, a nitrogen-containing organic compound, and a solvent. The silicone resin is obtained through cohydrolytic condensation of a mixture of three silane monomers containing a fluorinated norbornane group, an organic group having a carboxyl group protected with an acid labile group, and a lactone ring-bearing organic group, respectively. The resist composition has satisfactory resolution and overcomes the problem of a low selective etching ratio between resist film and organic film during oxygen reactive etching.
Claims8
A resist composition comprising
- (A) a silicone resin,
- (B) an acid generator,
- (C) an organic nitrogen-containing compound, and
- (D) an organic solvent,
- said silicone resin (A) being obtained through cohydrolytic condensation of a mixture comprising hydrolyzable silane monomers having the general formulae (1), (2) and (3):
- wherein R1, R2, and R3 each are hydrogen, fluorine, C1-C4 alkyl or C1-C4 fluoroalkyl group, at least one of R1, R2, and R3 contains fluorine, R4 is a C1-C6 hydrocarbon group with a straight, branched or cyclic structure,
- R5 is a C3-C20 organic group with a straight, branched, cyclic or polycyclic structure, which has a carboxyl group protected with an acid-decomposable protecting group as a functional group and which may further contain a halogen, oxygen or sulfur atom, R6 is as defined for R4,
- R7 is a C4-C16 organic group which has a lactone ring as a functional group and which may further contain a halogen, oxygen or sulfur atom, R8 is as defined for R4,
- X is hydrogen, chlorine, bromine, or a straight, branched or cyclic C1-C6 alkoxy group,
- p is 0 or 1, q is 0 or 1, and r is 0 or 1,
Dependencies are inferred from the claim text.