Method and apparatus for fabricating semiconductor chips using varying areas of precision

An apparatus that fabricates a semiconductor chip, comprising:

• a placing mechanism, which is configured to,
• place patterns for components which require fine line-widths within a high-resolution region of a reticle, wherein the high-resolution region provides sharp focus for a given wavelength of light used by the lithography system, and to
• place patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle,
• thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region;
• wherein the coarseness for components placed outside of the high-resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high-resolution region.

A semiconductor chip, comprising:

• the semiconductor chip;
• wherein the semiconductor chip includes components with fine line-widths located within a high-resolution exposure region for a reticle that is used to manufacture the chip, wherein the high-resolution exposure region provides sharp focus for a given wavelength of light used by the lithography system;
• wherein the semiconductor chip includes components with coarse line-widths outside of the high-resolution exposure region, thereby utilizing the region outside of the high-resolution exposure region instead of avoiding the region;
• and
• wherein the coarseness for components located outside of the high-resolution exposure region is increased to compensate for the loss of optical focus outside of the high-resolution exposure region.