Method of making a small substrate compatible for processing
AssigneeKoninklijke Philips Electronic, N.V.
InventorsJohan Klootwijk, Cornelis Timmering, Jacob Snijder, Ronald Dekker, Theodorus Michelsen
Life of this patent
Estimating the term…
Loading patent…
AssigneeKoninklijke Philips Electronic, N.V.
InventorsJohan Klootwijk, Cornelis Timmering, Jacob Snijder, Ronald Dekker, Theodorus Michelsen
Estimating the term…
A method of making a comparatively small substrate (12) compatible with manufacturing equipment for a larger-size standard substrate is disclosed. The standard substrate (1) has a surface (10) in which a depression (8) is formed, in which depression the small substrate is connected by means of a layer of a bonding material (13). The depression is formed so as to have a flat bottom (9) extending parallel to the surface. The depression has a depth such that, after the small substrate has been connected with its rear side to the bottom of the depression of the standard substrate by means of the layer of bonding material, the front side (14) of the small substrate forms a free surface which practically coincides with the surface (10) of the carrier wafer. When the standard substrate with the small substrate positioned in the depression is placed into a lithographic stepper, the free surface of the small substrate is placed automatically in a position such that patterns having very small dimensions can be projected onto a photoresist layer formed on said free surface.
A method of making a comparatively small substrate compatible for being processed in equipment designed for a larger standard substrate, wherein the standard substrate has a surface in which a cavity is formed, in which cavity the small substrate to be processed is attached by means of a layer of a bonding material, characterized in that the cavity in the standard substrate is formed so as to have a flat bottom, which extends parallel to the surface, and a depth such that, after the small substrate is attached with its rear side to the bottom of the cavity in the surface of the standard substrate by means of said layer of bonding material, the front side of said small substrate forms the free surface which substantially coincides with the surface of the standard substrate.
Dependencies are inferred from the claim text.