US 2007/0184178 A1Published application

Developing device and developing method

AssigneeTokyo Electron Limited

InventorsTaro Yamamoto, Kousuke Yoshihara, Hideharu Kyouda, Hirofumi Takeguchi, Atsushi Ookouchi

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Abstract

The temperature of a developing solution is varied depending on the type of resist or the resist pattern. The developing solution is applied while scanning a developer nozzle having a slit-shaped ejection port that has a length matching the width of the effective area of the substrate. After leaving the substrate with the developing solution being coated thereon for a predetermined period of time, a diluent is supplied while scanning a diluent nozzle, thereby substantially stopping the development reaction and causing the dissolved resist components to diffuse. A desired amount of resist can be quickly dissolved through the control of the developing solution temperature, while the development can be stopped before the dissolved resist components exhibit adverse effect through the supply of the diluent a predetermined timing, whereby achieving a pattern having a uniform line width and improved throughput.

Claims31

Dependent claims

A developing apparatus comprising:

a substrate holding unit for holding a substrate in a substantially horizontal attitude, the substrate having an exposed resist thereon;
a developer supply nozzle for delivering a developing solution to the substrate, the developer supply nozzle having therein an ejection port that has a length substantially equal to or larger than a width of an effective area of the substrate;
a diluent supply nozzle for delivering a diluent to the substrate, the diluent supply nozzle having therein an ejection port that has a length substantially equal to or larger than the width of the effective area of the substrate;
a temperature regulating unit for controlling temperature of the developing solution to be supplied from the developer supply nozzle according to a type of the resist on the substrate or a specific geometrical characteristic of a pattern of the resist;
a drive mechanism for moving the developer supply nozzle and the diluent supply nozzle from one end of the substrate to the opposite end of the substrate;
and
a control unit for controlling operation of the diluent supply nozzle such that the diluent is supplied to a surface of the substrate when the developing solution is deteriorated due to progression of developing reaction after supplying of the developing solution so that a developing reaction rate is lowered.

4 more elements

A developing method comprising the steps of:

applying a developing solution to a surface of an exposed resist film on a substrate by using a nozzle;
adjusting the temperature of the developing solution such that the resist in a region to be removed by developing is dissolved as much as needed, before the developing solution is applied;
leaving the substrate coated with the developing solution for a predetermined period of time to promote development reaction, thereby dissolving regions of the resist to be removed by the development reaction;
supplying, after the step of leaving the substrate, a diluent for reducing a concentration of the developing solution thereby for suppressing or stopping dissolving of the resist, to the substrate;
and
supplying, after the step of supplying the diluent, a cleaning liquid to the substrate for cleaning;
wherein the developing solution supplying step supplies the diluent when the developing solution is deteriorated due to progression of developing reaction after supplying of the developing solution so that a developing reaction rate is lowered.

4 more elements

Dependencies are inferred from the claim text.