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US 2007/0182841 A1Published application
Image sensing microelectronic device with glass tilt control features, and various methods of making same
OwnerDonnie Drake, Jorge Siqueirosinventors
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Abstract
Disclosed is an image sensing microelectronic device with glass tilt control features, and various methods of make same. In one illustrative embodiment, an image sensor die is disclosed which includes a substrate comprising an active area formed therein, a window positioned above the active area and a plurality of window tilt alignment features formed above the substrate, the window tilt alignment features being positioned between the window and the substrate.
Claims69
An image sensor die, comprising:
- a substrate comprising an active area formed therein;
- a window positioned above said active area;
- and
- a plurality of window tilt alignment features formed above said substrate, said window tilt alignment features being positioned between said window and said substrate.
1 more element
An image sensor die, comprising:
- a substrate comprising an active area formed therein;
- a window positioned above said active area;
- and
- two window tilt alignment features formed above said substrate, each of which are positioned on opposite sides of said active area, said window tilt alignment features being positioned between said window and said substrate, wherein said window contacts each of said window tilt alignment features.
1 more element
An image sensor die, comprising:
- a substrate comprising an active area formed therein;
- a window positioned above said active area;
- and
- four window tilt alignment features formed above said substrate, each of which is positioned proximate a side of said active area, said window tilt alignment features being positioned between said window and said substrate, wherein said window contacts each of said window tilt alignment features.
1 more element
An image sensor die, comprising:
- a substrate comprising an active area formed therein;
- a window positioned above said active area;
- and
- four window tilt alignment features formed above said substrate, each of which is positioned proximate a corner of said active area, said window tilt alignment features being positioned between said window and said substrate, wherein said window contacts each of said window tilt alignment features.
1 more element
An image sensor die, comprising:
- a substrate comprising an active area formed therein;
- a window positioned above said active area;
- and
- three window tilt alignment features formed above said substrate, said three window tilt alignment features being arranged in a triangular pattern around said active area, said window tilt alignment features being positioned between said window and said substrate, wherein said window contacts each of said window tilt alignment features.
1 more element
A method, comprising:
- forming a plurality of window tilt alignment features above a substrate of an image sensor die, said substrate comprising an active area;
- after forming said plurality of window tilt alignment features, forming an adhesive material on said substrate;
- positioning a window above said active area;
- and
- contacting said window with said adhesive material.
2 more elements
A method, comprising:
- forming a plurality of window tilt alignment features above a substrate of an image sensor die, said substrate comprising an active area, wherein said plurality of window tilt alignment features are formed from a first adhesive material and are allowed to at least partially cure;
- after forming said plurality of window tilt alignment features, forming a second adhesive material on said substrate;
- positioning a window above said active area;
- and
- contacting said window with said second adhesive material.
2 more elements
A method, comprising:
- forming a plurality of window tilt alignment features above a substrate of an image sensor die, said substrate comprising an active area, said forming of said plurality of window tilt control features comprising:
- forming a layer of material above said substrate;
- forming a masking layer above said layer of material;
- and
- performing an etching process to define said plurality of window tilt alignment features in said layer of material using said masking layer as an etch mask;
- after forming said plurality of window tilt alignment features, forming an adhesive material on said substrate;
- positioning a window above said active area;
- and
- contacting said window with said adhesive material.
6 more elements
A method, comprising:
- forming a plurality of window tilt alignment features comprised of a conductive material above a substrate of an image sensor die, said substrate comprising an active area;
- after forming said plurality of window tilt alignment features, forming an adhesive material on said substrate;
- positioning a window above said active area;
- and
- contacting said window with said adhesive material.
2 more elements
Dependencies are inferred from the claim text.