Insert with support for semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeck-Jin Jeong, Seon-Ju Oh, Seok-Young Yoon
Life of this patent
Estimating the term…
Abstract
An insert for loading a semiconductor package having external connection terminals may have a support plate. The support plate may have an upper surface with first contact pads and a lower surface with second contact pads. The first contact pads may be electrically connected to the external connection terminals of the semiconductor package and the second contact pads may be electrically connected to test connection terminals of a test socket.
Claims20
An insert for loading a semiconductor package, the semiconductor package having external connection terminals, the insert comprising:
- a body having a pocket configured to receive the semiconductor package;
- and
- a support plate having an upper surface and a lower surface, the support plate connected to the body and configured to support the semiconductor package,
- the upper surface of the support plate contacting the external connection terminals of the semiconductor package, and
- the support plate electrically connecting the external connection terminals to test connection terminals of a test socket.
An insert for loading a semiconductor package, the semiconductor package having external connection terminals, the insert comprising:
- a body having a pocket configured to receive the semiconductor package;
- and
- a support plate extending entirely across the pocket, the support plate having an upper surface facing the pocket and a lower surface facing away from the pocket,
- the support plate configured to electrically connect the external connection terminals to test connection terminals of a test socket.
Dependencies are inferred from the claim text.